After curing, there are bubbles to be analyzed from two aspects:
Bubbles are brought into the process of gluing or pouring. During the process of gluing, due to the high viscosity of the glue or the wrong stirring method, it is easy to bring air into the glue. If the viscosity of the glue is large, the bubbles are more difficult. eliminate. If the viscosity of the glue is small, and the glue is cured slowly, the bubbles will slowly rise to the surface and be eliminated automatically.
Second, the bubbles generated during the curing process. There are several reasons for bubbles in the curing process: too fast curing speed, high heat release temperature, large curing shrinkage rate of glue, too much solvent and plasticizer in the glue, it is easy to produce bubbles in the curing process. To solve these problems in the curing process, it is necessary to adjust the overall formula of the glue.
If you want to eliminate the air bubbles in the process of adjusting and gluing, you can eliminate the air bubbles by vacuuming, heating to reduce the viscosity, adding a thinner to reduce the viscosity, or adding an anti-foaming agent.
Operation requirements of silicone potting compound:
1. According to the weight, mix at a ratio of A:B=1:1 and stir evenly before sizing. Note: In order to ensure the good performance of the product, before the 1:1 mixing of the components A and B, they need to be fully stirred evenly, and then weight the product as sample for proportioning, the prepared rubber compound is evenly mixed and potting.
2. The operating time is mainly affected by the temperature in addition to the product formula. The curing will be accelerated when the temperature is high, the operating time will be shortened, the curing speed will be slow when the temperature is low, and the operating time will be extended.
3. The thermally conductive potting compound with sufficient mixing can be poured directly or poured into the container to be cured, either at room temperature or by heating and curing. If the potting height is thick and the appearance of the product after potting and curing is high, you can evacuate the bubble according to the situation and then encapsulate it.
4. Certain materials, chemicals, curing agents and plasticizers will hinder the curing of the thermally conductive potting compound (silicone), mainly including: organic tin and other organometallic compounds silicone rubber sulfur, polyvulcanization containing organic tin catalyst Substances, polysulfones or other sulfur-containing items. Ammonia, urethane or amine-containing articles are unsaturated hydrocarbon plasticizers and some flux residues.
Note: If there is any doubt about whether an object or material will cause impediment to curing, a small test is recommended to determine the applicability in this application. If there is no uncured or partially uncured phenomenon in the experiment, it can be used with confidence.
5. The two components should be sealed and stored separately so that they are ready for use. The mixed rubber should be used up at one time to avoid waste.
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