Product description

SAFE APPLICATIONS: BSFF is metal-free and non-conductive, eliminating any risk of short circuits, adding more protection to CPU and VGA cards.

Better than Liquid Metal: Thermal Conductivity: 13.9W/mk, composed of carbon particles with extremely high thermal conductivity. Make sure the heat generated by the CPU or GPU is dissipated efficiently.

THERMAL COMPOUND: BSFF Thermal Paste 2021 formulation with excellent component heat dissipation, with stability to push the system to its limits.

Easy to apply: BSFF thermal paste has an ideal consistency and is very easy to use even for beginners.

High Durability: Compared to metal and silicon thermally conductive adhesives, BSFF Thermal Paste 2021 will not be damaged over time. After you apply, you do not need to apply again as it will last for at least 5 years.